|Venue:||University of Tokyo|
|Start Date:||End Date:|
|Categories:||Electronics & Electricals|
IEEE International Workshop On Low Temperature Bonding For 3D Integration is all set to present an exclusive and thoroughly informative edition on low temperature bonding. The conference will discuss a wide range of relevant topics including but not restricted to Roles of Low temperature Bonding in 3D and Hetero Integration, Hydrophilic and Plasma assist Bonding and its Applications, Fundamentals of Nano bonding, New Processes for Low temperature Bonding, and SAB Tools for Volume Production.
IEEE International Workshop On Low Temperature Bonding For 3D Integration will facilitate exchange of cutting edge information and meaningful experiences that will serve as a resource of reference for the attendees.
Summary : The conference starts with registration and discuss on packaging based on rapidly emerging low-temperature bonding technology as well as other high density interconnect technologies
08:30 AM - 17:30 PM
Registration,Opening remarks,oral talk short presentation,lunch,oral talk,short presentation
17:30 PM - 0-1:0-1 AM
Leaving For Reception
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