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IC Packaging Technology Expo Date: 16-JAN-13 to 18-JAN-13 ICP - IC PACKAGING TECHNOLOGY EXPO is the most significant exhibition specialised in IC Final Manufacturing, (assembly, test and packaging). ICP gathers all lines of equipment, materials, manufacturing & testing services for manufacturing of fast-developing ICs such as SIPs, WCSPs, BGAs, FCs, etc. And held together is the SUBCONTRACTOR ZONE featuring the World's TOP companies in IC design, assembly and testing services. Venue: Tokyo International Exhibition Center (Tokyo Big Sight), Tokyo, Japan
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Verpackung Nord Date: 23-JAN-13 to 24-JAN-13 Verpackung Nord is a specialised trade show dedicated to users and buyers of packaging technology and equipment in northern Germany. VERPACKUNG provides a perfect platform for making contacts and doing business. VERPACKUNG is an efficient two-days-event with a clear message: Doing business the easy way! Venue: Hamburg Messe und Congress, Hamburg, Germany
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UPAKOVKA / UPAK Date: 29-JAN-13 to 01-FEB-13 UPAKOVKA / UPAK ITALIA, International Trade Fair Machinery and Equipment for theManufacture of Packaging, Packaging Machinery, Confectionery Machinery, Packaging and Packaging Aids, Logistics. Venue: Expocenter Krasnaya Presnya Moscow, Moscow, Moskva, Russia
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