IC Packaging Technology Expo

IC Packaging Technology Expo

2013-01-16 2013-01-18 16 - 18 JANUARY 2013
Tokyo International Exhibition Center (Tokyo Big Sight)3-21-1 Ariake, Koto-ku
Tokyo,
Japan

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ICP - IC PACKAGING TECHNOLOGY EXPO is the most significant exhibition specialised in IC Final Manufacturing, (assembly, test and packaging). ICP gathers all lines of equipment, materials, manufacturing & testing services for manufacturing of fast-developing ICs such as SIPs, WCSPs, BGAs, FCs, etc. And held together is the SUBCONTRACTOR ZONE featuring the World's TOP companies in IC design, assembly and testing services.
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Tokyo International Exhibition Center (Tokyo Big Sight)
Address : 3-21-1 Ariake, Koto-ku
City : Tokyo
Country : Japan
Coverage Area : 230,873 M
Hall Numbers : 2
Reed Exhibitions Japan LimitedReed Exhibitions Japan Limited
18F Shinjuku - Nomura Building, 1-26-2 Nishishinjuku, Shinjuku -
Tokyo, Japan
Tel: +(81)-(3)-33498501
Fax: +(81)-(3)-33498599Contact Organizer
Contact Person:
Event Manager
Tel: +81-3-33498502
Fax: +81-3-33494900
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Visitors' Profile

Professionals of semiconductor assembly & electronics manufacturers in fields such as: Production/Manufacturing, Engineering, Jisso, Design, R&D, Quality Control, Purchase etc. are the target visitors.

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Exhibitors' Profile

Profile for exhibit include Assembly Services, Assembly Equipment, Inspection Equipment, Testers, Measurement Packaging Materials, Components, Other Packaging Technology Packaging Sourcing, Related Services, Semiconductor Packaging Analysis Software, Other IC Packaging Technology Information, Industrial Journals.

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