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Internepcon Japan


Start Date  26-JAN-09 End Date  30-JAN-09

Venue City / State Country
Tokyo International Exhibition Center (Tokyo Big Sight)

Tokyo,
Tokyo
Japan

Event Profile:
INTERNEPCON JAPAN is the largest exhibition in Asia specialised in electronics manufacturing. INTERNEPCON JAPAN gathers all kinds of materials, equipment and technologies for electronics manufacturing and SMT.

Highlights:
ELECTROTEST JAPAN, IC PACKAGING TECHNOLOGY JAPAN,PRINTED WIRING BOARDS EXPO, INTERNATIONAL ELECTRONIC COMPONENTS TRADE SHOW

Visitor's Profile:
Electronics related Manufacturers (Home Appliances, Personal Computer Peripheral / Office Equipment, Audio / Visual Equipment, Test / Inspection Equipment, Aircraft / Vessel Equipment, Optical Instrument, Mobile Communication Systems Equipment, Semiconductor Assembly, Industrial Control / Factory Automation, Transportation Equipment, Medical Device and Others) are the target visitors.

Exhibitor's Profile:
Profile for exhibit include Electronics Packaging & Production, Soldering Machines, Materials and Technology, Factory Facility & Equipment, ERP & Production Management Systems, Other equipments.

Organizer:
Reed Exhibitions Japan Limited
18F Shinjuku - Nomura Building, 1-26-2 Nishishinjuku, Shinjuku - ku,
Tokyo, Japan.
Tel: +(81)-(3)-33498501
Fax: +(81)-(3)-33498599





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