| Start Date |
28-JAN-09 |
End Date |
30-JAN-09 |
| Venue |
City / State |
Country |
Tokyo International Exhibition Center (Tokyo Big Sight)
| Tokyo,
Tokyo |
Japan |
|
Event Profile:
ICP - IC PACKAGING TECHNOLOGY EXPO is the most significant exhibition specialised in IC Final Manufacturing, (assembly, test and packaging). ICP gathers all lines of equipment, materials, manufacturing & testing services for manufacturing of fast-developing ICs such as SIPs, WCSPs, BGAs, FCs, etc. And held together is the SUBCONTRACTOR ZONE featuring the World's TOP companies in IC design, assembly and testing services.
Highlights:
And held together is the SUBCONTRACTOR ZONE featuring the World's TOP companies in IC design, assembly and testing services. Concurrent events-IC PACKAGING TECHNOLOGY EXPO Technical Conference.
Visitor's Profile:
Professionals of semiconductor assembly & electronics manufacturers in fields such as: Production/Manufacturing, Engineering, Jisso, Design, R&D, Quality Control, Purchase etc. are the target visitors.
Exhibitor's Profile:
Profile for exhibit include Assembly Services, Assembly Equipment, Inspection Equipment, Testers, Measurement Packaging Materials, Components, Other Packaging Technology Packaging Sourcing, Related Services, Semiconductor Packaging Analysis Software, Other IC Packaging Technology Information, Industrial Journals.
Organizer: Reed Exhibitions Japan Limited
18F Shinjuku - Nomura Building, 1-26-2 Nishishinjuku, Shinjuku - ku,
Tokyo, Japan. Tel: +(81)-(3)-33498501 Fax: +(81)-(3)-33498599 |
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