IC Packaging Technology Expo
EVENT PROFILE
|
ICP - IC PACKAGING TECHNOLOGY EXPO is the most significant exhibition specialised in IC Final Manufacturing, (assembly, test and packaging). ICP gathers all lines of equipment, materials, manufacturing & testing services for manufacturing of fast-developing ICs such as SIPs, WCSPs, BGAs, FCs, etc. And held together is the SUBCONTRACTOR ZONE featuring the World's TOP companies in IC design, assembly and testing services. |
|
General Enquiry
HIGHLIGHTS
And held together is the SUBCONTRACTOR ZONE featuring the World's TOP companies in IC design, assembly and testing services. Concurrent events-IC PACKAGING TECHNOLOGY EXPO Technical Conference.
Sponsorship Enquiry
VISITOR'S PROFILE
Professionals of semiconductor assembly & electronics manufacturers in fields such as: Production/Manufacturing, Engineering, Jisso, Design, R&D, Quality Control, Purchase etc. are the target visitors.
Visitor Registration
EXHIBITOR'S PROFILE
Profile for exhibit include Assembly Services, Assembly Equipment, Inspection Equipment, Testers, Measurement Packaging Materials, Components, Other Packaging Technology Packaging Sourcing, Related Services, Semiconductor Packaging Analysis Software, Other IC Packaging Technology Information, Industrial Journals.
Stall Booking Organizer:
18F Shinjuku - Nomura Building, 1-26-2 Nishishinjuku, Shinjuku -, Tokyo, Japan.
Tel:+(81)-(3)-33498501
Fax:+(81)-(3)-33498599
PAST EVENT REVIEWS & EXPERIENCE
IC Packaging Technology Expo (ICP)-[2009]
Venue: Tokyo International Exhibition Center (Tokyo Big Sight), Tokyo, Japan
Date: Jan 28, 2009 - Jan 30, 2009
Note: Views are
moderated, and will not appear until our quality team has approved them.
CONCURRENT AND RELATED EVENTS
Internepcon Japan
Start Date: 20-JAN-10 End Date:22-JAN-10
Venue: Tokyo International Exhibition Center (Tokyo Big Sight), Tokyo, Japan
“Internepcon Japan is Asia's largest exhibition which showcases equipment, materials and technologies needed to manufacture SMT and electronic products. The 38th Internepcon japan will be organized by ...”
Electrotest Japan
Start Date: 20-JAN-10 End Date:22-JAN-10
Venue: Tokyo International Exhibition Center (Tokyo Big Sight), Tokyo, Japan
“ELECTROTEST JAPAN features all lines of test, inspection and measuring systems for SMT, IC Packaging and board manufacturing. Held inside NEPCON JAPAN, Asia's LARGEST AMT/electronics manufacturing...”
International Electronic Components Trade Show
Start Date: 20-JAN-10 End Date:22-JAN-10
Venue: Tokyo International Exhibition Center (Tokyo Big Sight), Tokyo, Japan
“International Electronic Components Trade Show (ELE TRADE) is an exhibition featuring Electronic Components and Devices. It is established as an indispensable opportunity for professionals of Design...”
Printed Wiring Boards Expo
Start Date: 20-JAN-10 End Date:22-JAN-10
Venue: Tokyo International Exhibition Center (Tokyo Big Sight), Tokyo, Japan
“Printed Wiring Boards Expo (PWB EXPO) is an exhibition featuring all kinds of PCBs/PWBs, Materials/Chemicals, Modular Boards, EMS and CAD tools. It is established as an indispensable opportunity for...”
Fiber Optics Expo
Start Date: 20-JAN-10 End Date:22-JAN-10
Venue: Tokyo International Exhibition Center (Tokyo Big Sight), Tokyo, Japan
“FOE - FIBER OPTICS EXPO is the largest exhibition in Asia specialised in fiber optical communication. FOE gathers all optical communication systems, equipment and devices -each exposing its maximum...”
MARCA-PRIVATE LABEL CONFERENCE & EXHIBITION
Start Date: 20-JAN-10 End Date:21-JAN-10
Venue: Bologna Fair Centre, Bologna, Italy
“MARCA - the one and only Italian event devoted to Private Label industry - is a reference point and innovative 'show window' addressed to large-scale retail trade and PL business community. MARCA is...”
Iran Pack & Print Exhibition
Start Date: 21-JAN-10 End Date:24-JAN-10
Venue: Tehran Permanent Fair Ground, Tehran, Iran
“Iran Pack & Print Exhibition is the International Presentation Machinery, Technology, Materials, Equipment and Supplies for Packaging and Printing Industries. This exposition aims to meet the ever-ris...”
Gastropack Expo
Start Date: 21-JAN-10 End Date:24-JAN-10
Venue: Bratislava Exhibition Ground, Bratislava, Slovakia
“Gastropack Expo is regarded as an essential event in the packaging industry calendar and international companies use it as a showcase for their latest product innovations. It is your opportunity to...”
