SMT / HYBRID / PACKAGING
EVENT PROFILE
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Traditionally the SMT/HYBRID/PACKAGING forms the ideal platform for the industry's leading companies. Among other things the show presents the latest trends and developments as well as up-to-date solutions. With foreign companies accounting for 33% of the exhibitors, the event offers not only a wide, but also an international spectrum. |
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General Enquiry
HIGHLIGHTS
From design and development to PCB production, components, packaging and test systems - SMT/HYBRID/PACKAGING offers a comprehensive and compact presentation of products all under one roof!
Sponsorship Enquiry
VISITOR'S PROFILE
Trade Visitors only - professional related to the field of material development, components and simulation, as well as semiconductor and packaging technologies & system integration.
Visitor Registration
EXHIBITOR'S PROFILE
Profile for exhibit include services, covering mechanical and electrical design, process simulation, rapid prototyping by stereo lithography and vacuum casting as well as 3D assembly and interconnection of mechatronic components, mechatronic encapsulation and system integration.
Stall Booking Organizer:
Rotebuehlstr, 83-85, Stuttgart, Germany.
Tel:+(49)-(711)-61946/61969
Fax:+(49)-(711)-61946/61990
PAST EVENT REVIEWS & EXPERIENCE
SMT / HYBRID / PACKAGING-[2009]
Venue: Exhibition Centre Nuremberg, Nuremberg, Germany
Date: May 05, 2009 - May 07, 2009
Note: Views are
moderated, and will not appear until our quality team has approved them.
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